Institut für Mikro- und Nanoelektronische Systeme

Main Research Areas

Development and Design of Integrated Circuits

    • Development of "system-on-chip" solutions using conventional microelectronic as well as novel nanoelectronic components
    • Development of integrated circuits for highly sensitive and extremely fast measurement techniques, for mobile communications and for automotive applications
    • Development of heterogeneous integrated circuits with superconductive, metallic and oxidic functional layers
    • Simulation of integrated high-frequency circuits
    • Simulation of integrated circuits with extremely high clock frequencies
    • Embedding of nanostructures into conventional integrated circuits

    Integrated Circuit and Embedded Sensor Technology 

    • Development of integration processes for heterogeneous functional layers
    • Development of THz and single-photon detectors
    • Development of integrated circuits for quantum computation (qubits)
    • Development of nanoelectronic and quantum devices
    • Magnetoelectronics for digital storage technologies and sensor applications
    • Integrated superconductive electronics

    Characterization and Test

    • "System-on-chip" performance tests
    • Device and circuit testing in a temperature range from 300 mK to 400 K
    • Network analysis of passive and active components in integrated devices
    • Characterization of dynamic switching performance
    • Functional evaluation of semiconductive, magnetic and metallic integrated devices
    • Noise measurements from DC up to very high frequencies



      Simulation and CAD Tools

      • IC design tools: CADENCE, MATLAB/SIMULINK
      • Hardware description language: VHDL
      • Logic simulation tools: SPICE-G3, CADENCE SPICE
      • ALTERA QUARTUS II design tool
      • Microwave simulations: SONNET, AGILENT ADS, IE3D, HFSS, MICROWAVE OFFICE


      • SUN Blade workstations
      • PC cluster
      • Printers, plotters, RAID system

      Integrated Circuit Fabrication Technology

      • Clean room with optical and electron beam lithography
      • Magnetron sputtering systems
      • Physical evaporation systems
      • Plasmachemical etching systems (RIE)
      • Ion beam etching systems (IBE)
      • Wet chemical etching
      • Scanning electron microscope with EDX for integrated circuit analysis
      • Thin film analysis with profilometer, ellipsometer and AFM
      • Microscopes (visual light and polarization)

      Instrumentation for Electrical Measurements

      • Measuring setups for testing and characterizing integrated circuits and devices in the frequency range DC up to 50 GHz
      • Signal and TDR analysis up to 50 GHz
      • Network and spectrum analyzer for frequencies up to 65 GHz
      • Noise analysis from DC up to 20 GHz
      • Device evaluation in the temperature range from 0.3 to 400 K
      • Magnetic fields up to 6 T

      Service and further Training

      • Consulting and advisory expertise for fabrication of heterogeneous integrated circuits, clean room environments and advanced lithography
      • Advice and development of special procedures in fabricating thin film structures with semiconducting, isolating, magnetic and oxidic functional layers
      • Design of user defined integrated circuits and devices for measurement techniques, signal processing, high frequency technology and for testing and characterizing corresponding devices
      • User specific layout and implementation in FPGA
      • Feasibility studies and research contracts in integrated circuit process development (E-beam lithography, thin film deposition, etching)

      Further Training

      • Seminars, lectures and hands-on courses in simulation techniques and technology
      Forschungsprojekte am IMS